驅動微波混成IC組裝技術至毫米波頻段(III)
| dc.contributor.author | 莊晴光 | en_US |
| dc.contributor.author | TZUANG CHING-KUANG C | en_US |
| dc.contributor.department | 交通大學電信工程系 | zh_TW |
| dc.date.accessioned | 2014-12-13T10:46:04Z | |
| dc.date.available | 2014-12-13T10:46:04Z | |
| dc.date.issued | 2000 | en_US |
| dc.description.sponsorship | 行政院國家科學委員會 | zh_TW |
| dc.identifier.govdoc | NSC89-2213-E009-243 | zh_TW |
| dc.identifier.uri | https://www.grb.gov.tw/search/planDetail?id=719022&docId=134926 | en_US |
| dc.identifier.uri | https://ir.lib.nycu.edu.tw/handle/11536/100627 | |
| dc.language.iso | zh_TW | en_US |
| dc.title | 驅動微波混成IC組裝技術至毫米波頻段(III) | zh_TW |
| dc.title | Moving Microwave Hybrid Integrated Circuit Assembly Technology Toward Millimeter-Wave Regime(III) | en_US |
| dc.type | Plan | en_US |