HETEROSTRUCTURE CONTAINING IC AND LED AND METHOD FOR FABRICATING THE SAME
| dc.citation.patentcountry | USA | zh_TW |
| dc.citation.patentnumber | 20140004630 | zh_TW |
| dc.contributor.author | CHEN KUAN-NENG | en_US |
| dc.contributor.author | KO CHENG-TA | en_US |
| dc.contributor.author | LO WEI-CHUNG | en_US |
| dc.date.accessioned | 2014-12-16T06:14:52Z | |
| dc.date.available | 2014-12-16T06:14:52Z | |
| dc.date.issued | 2014-01-02 | en_US |
| dc.description.abstract | A heterostructure containing IC and LED and a method of fabricating. An IC and an LED are established with the IC having a first electric-conduction block and a first connection block. The IC electrically connects to the first electric-conduction block. A first face of the LED has a second electric-conduction block and a second connection block. The LED is electrically connected to the second electric-conduction block. The first electric-conduction block and the first connection block are respectively joined to the second electric-conduction block and the second connection block, and the first electric-conduction block are electrically connected with the second electric-conduction block to form a heterostructure. The heterostructure provides functions of heat radiation and electric communication for IC and LED. | zh_TW |
| dc.identifier.govdoc | H01L033/62 | zh_TW |
| dc.identifier.uri | https://ir.lib.nycu.edu.tw/handle/11536/104967 | |
| dc.language.iso | zh_TW | en_US |
| dc.title | HETEROSTRUCTURE CONTAINING IC AND LED AND METHOD FOR FABRICATING THE SAME | zh_TW |
| dc.type | Patents | en_US |