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一種氮化物半導體磊晶層的表面處理方法

dc.citation.patentcountryTWNzh_TW
dc.citation.patentnumberI407506zh_TW
dc.contributor.author李威儀en_US
dc.contributor.author徐瑩珈en_US
dc.contributor.author葉彥顯en_US
dc.contributor.author陳奎銘en_US
dc.date.accessioned2014-12-16T06:15:26Z
dc.date.available2014-12-16T06:15:26Z
dc.date.issued2013-09-01en_US
dc.description.abstract本發明揭露一種氮化物半導體磊晶層的表面處理方法,在特定溫度和壓力的環境中,於氮化物半導體磊晶層上通入特定的蝕刻氣體,經過特定的時間,可於氮化物半導體磊晶層表面產生特定的形貌。本發明可直接在氮化物半導體之表面產生圖樣化結構,可大幅降低製造成本。zh_TW
dc.identifier.govdocH01L021/3065zh_TW
dc.identifier.urihttps://ir.lib.nycu.edu.tw/handle/11536/105319
dc.language.isozh_TWen_US
dc.title一種氮化物半導體磊晶層的表面處理方法zh_TW
dc.typePatentsen_US

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