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高性混合訊號式發收機積體電路---子計畫I:互補式金氧半射頻發收機前置電路模組設計IP建立及應用研究

dc.contributor.author吳重雨en_US
dc.contributor.authorCHUNG-YUWUen_US
dc.contributor.department交通大學電子工程系zh_TW
dc.date.accessioned2014-12-13T10:36:22Z
dc.date.available2014-12-13T10:36:22Z
dc.date.issued2000en_US
dc.description.sponsorship行政院國家科學委員會zh_TW
dc.identifier.govdocNSC89-2215-E009-064zh_TW
dc.identifier.urihttps://www.grb.gov.tw/search/planDetail?id=542380&docId=99657en_US
dc.identifier.urihttps://ir.lib.nycu.edu.tw/handle/11536/93895
dc.language.isozh_TWen_US
dc.subject互補式金氧半導體zh_TW
dc.subject收發器zh_TW
dc.subject低雜訊放大器zh_TW
dc.subject混波器zh_TW
dc.subject電壓控制振盪器zh_TW
dc.subject單晶片系統zh_TW
dc.subjectCMOSen_US
dc.subjectTransceiveren_US
dc.subjectLNAen_US
dc.subjectMixeren_US
dc.subjectVoltage-controlled oscillator (VCO)en_US
dc.subjectSystem-on-a-chip (SOC)en_US
dc.title高性混合訊號式發收機積體電路---子計畫I:互補式金氧半射頻發收機前置電路模組設計IP建立及應用研究zh_TW
dc.titleThe Design of CMOS Front-End IC Modules and IP Cores for RF Transceivers in Various Applicationsen_US
dc.typePlanen_US

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