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MBE-Enabling technology beyond Si CMOS

dc.citation.epage517en_US
dc.citation.issue1en_US
dc.citation.spage511en_US
dc.citation.volume323en_US
dc.contributor.authorChang, P.en_US
dc.contributor.authorLee, W. C.en_US
dc.contributor.authorLin, T. D.en_US
dc.contributor.authorHsu, C. H.en_US
dc.contributor.authorKwo, J.en_US
dc.contributor.authorHong, M.en_US
dc.contributor.department光電工程學系zh_TW
dc.contributor.departmentDepartment of Photonicsen_US
dc.date.accessioned2014-12-08T15:46:42Z
dc.date.available2014-12-08T15:46:42Z
dc.date.issued2011-05-15en_US
dc.description.abstractAchievement of low interfacial densities of states, small equivalent oxide thickness, high kappa values, and thermal stability at high temperatures in the high kappa dielectrics on high carrier mobility semiconductors, the leading candidates for technology beyond Si CMOS, has been made using MBE. This paper reviews our recent advances in meeting the unprecedented demands in materials and physics for the new technology. Moreover, self-aligned inversion-channel InGaAs and Ge MOSFETs using MBE-Ga(2)O(3)(Gd(2)O(3)) as the gate dielectric are compared favorably with those using the gate dielectrics made from other thin film techniques. (C) 2010 Elsevier B.V. All rights reserved.en_US
dc.identifier.doi10.1016/j.jcrysgro.2010.11.102en_US
dc.identifier.issn0022-0248en_US
dc.identifier.journalJOURNAL OF CRYSTAL GROWTHen_US
dc.identifier.urihttp://dx.doi.org/10.1016/j.jcrysgro.2010.11.102en_US
dc.identifier.urihttps://ir.lib.nycu.edu.tw/handle/11536/31397
dc.identifier.wosnumberWOS:000292175000130
dc.language.isoen_USen_US
dc.subjectSingle crystal growthen_US
dc.subjectMolecular beam epitaxyen_US
dc.subjectHigh kappa dielectricsen_US
dc.subjectHigh carrier mobility semiconductorsen_US
dc.subjectIII-V MOSFETen_US
dc.subjectGe MOSFETen_US
dc.titleMBE-Enabling technology beyond Si CMOSen_US
dc.typeArticle; Proceedings Paperen_US

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