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Electrical and reliability characteristics of 1nm ultrathin oxynitride gate dielectric prepared by RTP

dc.citation.epage352en_US
dc.citation.spage349en_US
dc.contributor.authorYang, WCen_US
dc.contributor.authorChen, CFen_US
dc.contributor.authorChang, KMen_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.date.accessioned2014-12-08T15:26:17Z
dc.date.available2014-12-08T15:26:17Z
dc.date.issued2003en_US
dc.description.abstractUltra low leakage and highly reliable 1 nm gate oxynitride films were successfully developed. Ultrathin oxynitride films were prepared by RTP in N-2/O-2 = 5/1 (slm) optimum mixed gas ambient These films show excellent interface properties, significantly low gate leakage current, and superior enhanced reliability. Moreover, interface trap generation under higher field stressing was also investigated.en_US
dc.identifier.isbn0-7803-7749-4en_US
dc.identifier.journal2003 IEEE CONFERENCE ON ELECTRON DEVICES AND SOLID-STATE CIRCUITSen_US
dc.identifier.urihttps://ir.lib.nycu.edu.tw/handle/11536/18671
dc.identifier.wosnumberWOS:000189450800077
dc.language.isoen_USen_US
dc.titleElectrical and reliability characteristics of 1nm ultrathin oxynitride gate dielectric prepared by RTPen_US
dc.typeProceedings Paperen_US

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