Investigation and Effects of Wafer Bow in 3D Integration Bonding Schemes
| dc.citation.epage | 2610 | en_US |
| dc.citation.issue | 12 | en_US |
| dc.citation.spage | 2605 | en_US |
| dc.citation.volume | 39 | en_US |
| dc.contributor.author | Chen, K. N. | en_US |
| dc.contributor.author | Zhu, Y. | en_US |
| dc.contributor.author | Wu, W. W. | en_US |
| dc.contributor.author | Reif, R. | en_US |
| dc.contributor.department | 材料科學與工程學系 | zh_TW |
| dc.contributor.department | 電子工程學系及電子研究所 | zh_TW |
| dc.contributor.department | Department of Materials Science and Engineering | en_US |
| dc.contributor.department | Department of Electronics Engineering and Institute of Electronics | en_US |
| dc.date.accessioned | 2014-12-08T15:06:41Z | |
| dc.date.available | 2014-12-08T15:06:41Z | |
| dc.date.issued | 2010-12-01 | en_US |
| dc.description.abstract | This paper investigates and reviews the effects of wafer bow in three- dimensional (3D) integration bonding schemes, including copper wafer bonding and oxide fusion wafer bonding with silicon on insulator (SOI)-based layer transfer technology. Wafer bow criteria for good bonding quality and fabrication techniques to minimize wafer bow are introduced for 3D integration technology and applications. | en_US |
| dc.identifier.doi | 10.1007/s11664-010-1341-y | en_US |
| dc.identifier.issn | 0361-5235 | en_US |
| dc.identifier.journal | JOURNAL OF ELECTRONIC MATERIALS | en_US |
| dc.identifier.uri | http://dx.doi.org/10.1007/s11664-010-1341-y | en_US |
| dc.identifier.uri | https://ir.lib.nycu.edu.tw/handle/11536/5234 | |
| dc.identifier.wosnumber | WOS:000283509000015 | |
| dc.language.iso | en_US | en_US |
| dc.subject | Wafer bow | en_US |
| dc.subject | wafer bonding | en_US |
| dc.subject | 3D integration | en_US |
| dc.title | Investigation and Effects of Wafer Bow in 3D Integration Bonding Schemes | en_US |
| dc.type | Article; Proceedings Paper | en_US |