<link rel="stylesheet" href="styles.cf390c6bfbe7555f.css"> Skip to main content

微波介電材料低溫燒結及積層技術(II)(III)

dc.contributor.author林鵬en_US
dc.contributor.authorLIN PANGen_US
dc.contributor.department交通大學材料科學與工程系zh_TW
dc.date.accessioned2014-12-13T10:35:01Z
dc.date.available2014-12-13T10:35:01Z
dc.date.issued2000en_US
dc.description.sponsorship行政院國家科學委員會zh_TW
dc.identifier.govdocNSC89-2213-E009-078zh_TW
dc.identifier.urihttps://www.grb.gov.tw/search/planDetail?id=512538&docId=92774en_US
dc.identifier.urihttps://ir.lib.nycu.edu.tw/handle/11536/93152
dc.language.isozh_TWen_US
dc.subject微波zh_TW
dc.subject介電材料zh_TW
dc.subject燒結zh_TW
dc.subject積層zh_TW
dc.subjectMicrowaueen_US
dc.subjectDielectricen_US
dc.subjectSinteringen_US
dc.subjectMultilayeren_US
dc.title微波介電材料低溫燒結及積層技術(II)(III)zh_TW
dc.titleMicrowave Dielectrics for Low-Temperature Sintering and Multilayer Technology(II)(III)en_US
dc.typePlanen_US

Files

License bundle

Now showing 1 - 1 of 1
Loading...
Thumbnail Image
Name:
license.txt
Size:
1.71 KB
Format:
Item-specific license agreed to upon submission
Description: