An AOI Approach for IC Lead Index Auto-verification
| dc.citation.volume | 7544 | en_US |
| dc.contributor.author | Perng, Der-Baau | en_US |
| dc.contributor.author | Chang, Guei-Ci | en_US |
| dc.contributor.author | Lee, Shu-Ming | en_US |
| dc.contributor.author | Chen, Ssu-Han | en_US |
| dc.contributor.department | 工業工程與管理學系 | zh_TW |
| dc.contributor.department | Department of Industrial Engineering and Management | en_US |
| dc.date.accessioned | 2014-12-08T15:25:03Z | |
| dc.date.available | 2014-12-08T15:25:03Z | |
| dc.date.issued | 2010 | en_US |
| dc.description.abstract | To wire-bond automatically, the IC lead positions on the CAD drawing and the corresponding ones on the extracted substrate image should be pre-verified. This paper proposed an AOI approach for IC lead index auto-verification which conquered the lead shape distortion, golden exposed, shifting, rotation, and scaling difficulties of extracted substrate image. Experimentations revealed that the proposed AOI approach can accurately verify the corresponding leads between a CAD drawing and the extracted substrate image with high repeatability. | en_US |
| dc.identifier.doi | 10.1117/12.886015 | en_US |
| dc.identifier.isbn | 978-0-81947-940-2 | en_US |
| dc.identifier.issn | 0277-786X | en_US |
| dc.identifier.journal | 6TH INTERNATIONAL SYMPOSIUM ON PRECISION ENGINEERING MEASUREMENTS AND INSTRUMENTATION | en_US |
| dc.identifier.uri | http://dx.doi.org/10.1117/12.886015 | en_US |
| dc.identifier.uri | https://ir.lib.nycu.edu.tw/handle/11536/17416 | |
| dc.identifier.wosnumber | WOS:000290255700251 | |
| dc.language.iso | en_US | en_US |
| dc.subject | substrate | en_US |
| dc.subject | lead verification | en_US |
| dc.subject | particle swarm optimization | en_US |
| dc.title | An AOI Approach for IC Lead Index Auto-verification | en_US |
| dc.type | Article | en_US |