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Modulation of the Electrical Characteristics of HfOx/TiN RRAM Devices through the Top Electrode Metal

dc.citation.epage126en_US
dc.citation.issue2en_US
dc.citation.spage119en_US
dc.citation.volume28en_US
dc.contributor.authorChang, K. M.en_US
dc.contributor.authorTzeng, W. H.en_US
dc.contributor.authorLiu, K. C.en_US
dc.contributor.authorLai, W. R.en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.date.accessioned2014-12-08T15:29:05Z
dc.date.available2014-12-08T15:29:05Z
dc.date.issued2010en_US
dc.description.abstractThe effect of the top electrode on switching characteristics of a HfOx/TiN structure was investigated. From the electrical conduction analysis, the conduction mechanism between Pt and Ti was found to be quite different. A potential barrier formed in the Pt/HfOx interface showing the Fowler-Nordheim tunneling at high bias. However, it was not observed in the Ti/HfOx structure. Reactive metal Ti interacted with the underlying HfOx film leading to destruction of the barrier height. As such, the device lost the ability to operate at the mu A compliance current range. Pt/HfOx demonstrated the merit of a large resistance ratio and a low operation current (Ireset = 20 mu A). However, Ti/HfOx exhibited better voltage dispersion at the low resistance state (0.5V dispersion). The electrode plays a dominant role in determining the electrical characteristics of a resistive random access memory (RRAM) device. Therefore, choosing an adequate electrode for RRAM is an important consideration.en_US
dc.identifier.doi10.1149/1.3372569en_US
dc.identifier.isbn978-1-60768-142-7en_US
dc.identifier.issn1938-5862en_US
dc.identifier.journalDIELECTRICS FOR NANOSYSTEMS 4: MATERIALS SCIENCE, PROCESSING, RELIABILITY, AND MANUFACTURINGen_US
dc.identifier.urihttp://dx.doi.org/10.1149/1.3372569en_US
dc.identifier.urihttps://ir.lib.nycu.edu.tw/handle/11536/20989
dc.identifier.wosnumberWOS:000313250400010
dc.language.isoen_USen_US
dc.titleModulation of the Electrical Characteristics of HfOx/TiN RRAM Devices through the Top Electrode Metalen_US
dc.typeProceedings Paperen_US

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