電流對無鉛銲料與其接點之影響---子計畫I：無鉛銲錫的電遷移研究(II)
| dc.contributor.author | 陳智 | en_US |
| dc.contributor.author | Chen Chih | en_US |
| dc.contributor.department | 國立交通大學材料科學與工程學系 | zh_TW |
| dc.date.accessioned | 2014-12-13T10:32:53Z | |
| dc.date.available | 2014-12-13T10:32:53Z | |
| dc.date.issued | 2003 | en_US |
| dc.description.sponsorship | 行政院國家科學委員會 | zh_TW |
| dc.identifier.govdoc | NSC92-2216-E009-008 | zh_TW |
| dc.identifier.uri | https://www.grb.gov.tw/search/planDetail?id=828315&docId=156977 | en_US |
| dc.identifier.uri | https://ir.lib.nycu.edu.tw/handle/11536/91776 | |
| dc.language.iso | zh_TW | en_US |
| dc.title | 電流對無鉛銲料與其接點之影響---子計畫I：無鉛銲錫的電遷移研究(II) | zh_TW |
| dc.title | A Systematic Study of Electromigration in Pb-Free Solders (II) | en_US |
| dc.type | Plan | en_US |
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