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金氧半場效電晶體之閘極結構

dc.citation.patentcountryTWNzh_TW
dc.citation.patentnumber00559917zh_TW
dc.contributor.author崔秉鉞en_US
dc.contributor.author黃誌鋒en_US
dc.date.accessioned2014-12-16T06:17:29Z
dc.date.available2014-12-16T06:17:29Z
dc.date.issued2003-11-01en_US
dc.description.abstract本發明係提出一種新的合金系統,用以解決金氧半場效電晶體金屬閘極功函數的不適性,促使表面通道電晶體起始電壓係可有效降低,達到低工作電壓之要求,本合金系統以化學性質不活潑且熱穩定性極佳的鉑金屬(Pt)為主成分,加入不同比例之低功函數材料,例如:鉭(Ta)或鈦(Ti),以達成調整功函數之目的。合金閘的製作方法可以是同時濺鍍(co-sputter)或是同時蒸鍍(co-evaporation)的物理氣象沉積方式,依所需之成分調整鉑靶及低功函數金屬靶之沉積速率,以合成適當的鉑合金,亦可以使用事先合成之合金靶,以單純物理性濺鍍方式製作。zh_TW
dc.identifier.govdocH01L021/28zh_TW
dc.identifier.govdocH01L021/28zh_TW
dc.identifier.urihttps://ir.lib.nycu.edu.tw/handle/11536/106456
dc.language.isozh_TWen_US
dc.title金氧半場效電晶體之閘極結構zh_TW
dc.typePatentsen_US

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