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可撓曲非揮發性記憶體及其製造方法

dc.citation.patentcountryTWNzh_TW
dc.citation.patentnumber201411781zh_TW
dc.contributor.author劉柏村en_US
dc.contributor.author范揚順en_US
dc.date.accessioned2014-12-16T06:17:46Z
dc.date.available2014-12-16T06:17:46Z
dc.date.issued2014-03-16en_US
dc.description.abstract一種可撓曲非揮發性記憶體之製造方法,包含:提供可撓曲基板;形成平坦層於可撓曲基板上;沉積金屬底電極層於平坦層上;形成光罩,以定義複數圖樣;對應圖樣沉積包含電性獨立之複數氧化鋁鋅錫電阻切換單元之氧化鋁鋅錫電阻切換層於該金屬底電極層上;以及對應氧化鋁鋅錫電阻切換單元沉積頂電極層於氧化鋁鋅錫電阻切換層上,俾形成複數非揮發性記憶體單元。zh_TW
dc.identifier.govdocH01L021/8247zh_TW
dc.identifier.govdocH01L027/115zh_TW
dc.identifier.urihttps://ir.lib.nycu.edu.tw/handle/11536/106579
dc.language.isozh_TWen_US
dc.title可撓曲非揮發性記憶體及其製造方法zh_TW
dc.typePatentsen_US

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