微波頻段球柵陣列封裝基板與嵌入式被動元件技術之開發
| dc.contributor.author | 吳霖？ | en_US |
| dc.contributor.author | WU LIN-KUN | en_US |
| dc.contributor.department | 國立交通大學電信工程學系 | zh_TW |
| dc.date.accessioned | 2014-12-13T10:37:55Z | |
| dc.date.available | 2014-12-13T10:37:55Z | |
| dc.date.issued | 2001 | en_US |
| dc.description.sponsorship | 行政院國家科學委員會 | zh_TW |
| dc.identifier.govdoc | NSC90-2213-E009-065 | zh_TW |
| dc.identifier.uri | https://www.grb.gov.tw/search/planDetail?id=663556&docId=125801 | en_US |
| dc.identifier.uri | https://ir.lib.nycu.edu.tw/handle/11536/94943 | |
| dc.language.iso | zh_TW | en_US |
| dc.subject | 微波 | zh_TW |
| dc.subject | 球柵陣列 | zh_TW |
| dc.subject | 被動元件 | zh_TW |
| dc.subject | Microwave | en_US |
| dc.subject | BGA | en_US |
| dc.subject | Passive element | en_US |
| dc.title | 微波頻段球柵陣列封裝基板與嵌入式被動元件技術之開發 | zh_TW |
| dc.title | Development of Technologies for Microwave BGA Package Substrates and Embedded Passives | en_US |
| dc.type | Plan | en_US |
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