無線通訊用基層微波陶瓷元件之研發---總計畫(III)
| dc.contributor.author | 林鵬 | en_US |
| dc.contributor.author | LIN PANG | en_US |
| dc.contributor.department | 交通大學材料科學與工程系 | zh_TW |
| dc.date.accessioned | 2014-12-13T10:36:10Z | |
| dc.date.available | 2014-12-13T10:36:10Z | |
| dc.date.issued | 2000 | en_US |
| dc.description.sponsorship | 行政院國家科學委員會 | zh_TW |
| dc.identifier.govdoc | NSC89-2213-E009-136 | zh_TW |
| dc.identifier.uri | https://www.grb.gov.tw/search/planDetail?id=531572&docId=97140 | en_US |
| dc.identifier.uri | https://ir.lib.nycu.edu.tw/handle/11536/93815 | |
| dc.language.iso | zh_TW | en_US |
| dc.subject | 無線通訊 | zh_TW |
| dc.subject | 積層陶瓷元件 | zh_TW |
| dc.subject | 材料介電性質 | zh_TW |
| dc.subject | 厚膜 | zh_TW |
| dc.subject | Wireless communication | en_US |
| dc.subject | Multilayer ceramic device | en_US |
| dc.subject | Dielectricity | en_US |
| dc.subject | Thick film | en_US |
| dc.title | 無線通訊用基層微波陶瓷元件之研發---總計畫(III) | zh_TW |
| dc.title | Multilayer Microwave Ceramic Device for Wireless Communication (III) | en_US |
| dc.type | Plan | en_US |