METHOD OF SEMICONDUCTOR MANUFACTURING PROCESS
| dc.citation.patentcountry | USA | zh_TW |
| dc.citation.patentnumber | 20120231614 | zh_TW |
| dc.contributor.author | Wu YewChung Sermon | en_US |
| dc.contributor.author | Wang Bau-Ming | en_US |
| dc.contributor.author | Hsiao Feng-Ching | en_US |
| dc.date.accessioned | 2014-12-16T06:15:06Z | |
| dc.date.available | 2014-12-16T06:15:06Z | |
| dc.date.issued | 2012-09-13 | en_US |
| dc.description.abstract | The present invention related to a method for manufacturing a semiconductor, comprising steps of: providing a growing substrate; forming a semiconductor substrate on the growing substrate; forming a first structure with plural grooves and between the growing substrate and the semiconductor substrate; and changing the temperature of the growing substrate and the semiconductor substrate. | zh_TW |
| dc.identifier.govdoc | H01L021/20 | zh_TW |
| dc.identifier.govdoc | H01L021/26 | zh_TW |
| dc.identifier.uri | https://ir.lib.nycu.edu.tw/handle/11536/105133 | |
| dc.language.iso | zh_TW | en_US |
| dc.title | METHOD OF SEMICONDUCTOR MANUFACTURING PROCESS | zh_TW |
| dc.type | Patents | en_US |