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智慧型仿生系統之晶片系統平台技術開發---子計畫三:應用於智慧型仿生系統晶片之高壓輸入/輸出電路設計(III)

dc.contributor.author柯明道en_US
dc.contributor.authorKER MING-DOUen_US
dc.contributor.department國立交通大學電子工程學系及電子研究所zh_TW
dc.date.accessioned2014-12-13T10:46:00Z
dc.date.available2014-12-13T10:46:00Z
dc.date.issued2010en_US
dc.description.sponsorship行政院國家科學委員會zh_TW
dc.identifier.govdocNSC99-2220-E009-021zh_TW
dc.identifier.urihttps://www.grb.gov.tw/search/planDetail?id=2159283&docId=347524en_US
dc.identifier.urihttps://ir.lib.nycu.edu.tw/handle/11536/100552
dc.language.isozh_TWen_US
dc.subject輸入輸出電路zh_TW
dc.subject可靠度zh_TW
dc.subject靜電防護zh_TW
dc.subject仿生系統晶片zh_TW
dc.subjectInput/Output Driveren_US
dc.subjectreliabilityen_US
dc.subjectESDen_US
dc.subjectIntelligent Prostheses SOC.en_US
dc.title智慧型仿生系統之晶片系統平台技術開發---子計畫三:應用於智慧型仿生系統晶片之高壓輸入/輸出電路設計(III)zh_TW
dc.titleHigh-Voltage Input/Output Driver Circuits for Intelligent Prostheses SoC Applications (III)en_US
dc.typePlanen_US

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