<link rel="stylesheet" href="styles.cf390c6bfbe7555f.css"> Skip to main content

Characterization and modeling of on-chip inductor substrate coupling effect

dc.citation.epage160en_US
dc.citation.spage157en_US
dc.contributor.authorChao, CJen_US
dc.contributor.authorWong, SCen_US
dc.contributor.authorHsu, CJen_US
dc.contributor.authorChen, MJen_US
dc.contributor.authorLeu, LYen_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.date.accessioned2014-12-08T15:26:30Z
dc.date.available2014-12-08T15:26:30Z
dc.date.issued2002en_US
dc.description.abstractThe substrate coupling effects of two adjacent coplanar spiral inductors are characterized and modeled. The noise magnitude between two 45mum-away inductors can be reduced by 6.83 dB by using guard-ring surrounding each inductor, and improved by 10.28 dB further by adding patterned ground polysilicon shield beneath at 3 GHz. The inductor with patterned polysilicon shield beneath shows improved quality factor and noise isolation. Moreover, a macro model is presented for modeling quality factor and inductance of on-chip spiral inductor and associated neighboring inductor's coupling noise effect.en_US
dc.identifier.doi10.1109/MWSYM.2002.1011583en_US
dc.identifier.isbn0-7803-7239-5en_US
dc.identifier.issn0149-645Xen_US
dc.identifier.journal2002 IEEE MTT-S INTERNATIONAL MICROWAVE SYMPOSIUM DIGEST, VOLS 1-3en_US
dc.identifier.urihttp://dx.doi.org/10.1109/MWSYM.2002.1011583en_US
dc.identifier.urihttps://ir.lib.nycu.edu.tw/handle/11536/18825
dc.identifier.wosnumberWOS:000178310900035
dc.language.isoen_USen_US
dc.titleCharacterization and modeling of on-chip inductor substrate coupling effecten_US
dc.typeProceedings Paperen_US

Files

Original bundle

Now showing 1 - 1 of 1
Loading...
Thumbnail Image
Name:
000178310900035.pdf
Size:
414.23 KB
Format:
Adobe Portable Document Format

License bundle

Now showing 1 - 1 of 1
Loading...
Thumbnail Image
Name:
license.txt
Size:
1.71 KB
Format:
Item-specific license agreed to upon submission
Description: