極大型積體電路之深次微米元件及分析及模擬的研究(III)
| dc.contributor.author | 吳慶源 | en_US |
| dc.contributor.department | 國立交通大學電子工程學系 | zh_TW |
| dc.date.accessioned | 2014-12-13T10:37:21Z | |
| dc.date.available | 2014-12-13T10:37:21Z | |
| dc.date.issued | 2001 | en_US |
| dc.description.sponsorship | 行政院國家科學委員會 | zh_TW |
| dc.identifier.govdoc | NSC90-2215-E009-114 | zh_TW |
| dc.identifier.uri | https://www.grb.gov.tw/search/planDetail?id=665837&docId=126408 | en_US |
| dc.identifier.uri | https://ir.lib.nycu.edu.tw/handle/11536/94565 | |
| dc.language.iso | zh_TW | en_US |
| dc.subject | 深次微米元件 | zh_TW |
| dc.subject | 極大型積體電路 | zh_TW |
| dc.subject | Deep submicron device | en_US |
| dc.subject | ULSI | en_US |
| dc.title | 極大型積體電路之深次微米元件及分析及模擬的研究(III) | zh_TW |
| dc.title | Characterization and Modeling Techniques of Deep-Submicrometer Devices for ULSI Circuits (III) | en_US |
| dc.type | Plan | en_US |
Files
License bundle
1 - 1 of 1
Loading...
- Name:
- license.txt
- Size:
- 1.71 KB
- Format:
- Item-specific license agreed to upon submission
- Description: