以ICP-RIE配合複合奈米強化微電鑄之LIGA法製作高寬深比合金模仁之微結構與機械性質
| dc.contributor.author | 涂肇嘉 | en_US |
| dc.contributor.department | 交通大學材料科學與工程系 | zh_TW |
| dc.date.accessioned | 2014-12-13T10:34:53Z | |
| dc.date.available | 2014-12-13T10:34:53Z | |
| dc.date.issued | 2002 | en_US |
| dc.description.sponsorship | 行政院國家科學委員會 | zh_TW |
| dc.identifier.govdoc | NSC91-2216-E009-020 | zh_TW |
| dc.identifier.uri | https://www.grb.gov.tw/search/planDetail?id=785491&docId=151051 | en_US |
| dc.identifier.uri | https://ir.lib.nycu.edu.tw/handle/11536/93060 | |
| dc.language.iso | zh_TW | en_US |
| dc.title | 以ICP-RIE配合複合奈米強化微電鑄之LIGA法製作高寬深比合金模仁之微結構與機械性質 | zh_TW |
| dc.title | The Microstructure and Mechanical Property of High Aspect Ratio Mold Insert by LIGA Method of ICP-RIE with Nano-Strengthened Composite Microelectroplating | en_US |
| dc.type | Plan | en_US |