CHARACTERIZATION OF CHEMICAL-MECHANICAL POLISHING DIELECTRICS FOR MULTILEVEL METALLIZATION
| dc.citation.epage | 144 | en_US |
| dc.citation.spage | 139 | en_US |
| dc.citation.volume | 337 | en_US |
| dc.contributor.author | SUN, SC | en_US |
| dc.contributor.author | YEH, FL | en_US |
| dc.contributor.author | TIEN, HZ | en_US |
| dc.contributor.department | 奈米中心 | zh_TW |
| dc.contributor.department | Nano Facility Center | en_US |
| dc.date.accessioned | 2014-12-08T15:27:49Z | |
| dc.date.available | 2014-12-08T15:27:49Z | |
| dc.date.issued | 1994 | en_US |
| dc.identifier.isbn | 1-55899-237-5 | en_US |
| dc.identifier.issn | 0272-9172 | en_US |
| dc.identifier.journal | ADVANCED METALLIZATION FOR DEVICES AND CIRCUITS - SCIENCE, TECHNOLOGY AND MANUFACTURABILITY | en_US |
| dc.identifier.uri | https://ir.lib.nycu.edu.tw/handle/11536/20056 | |
| dc.identifier.wosnumber | WOS:A1994BB59J00014 | |
| dc.language.iso | en_US | en_US |
| dc.title | CHARACTERIZATION OF CHEMICAL-MECHANICAL POLISHING DIELECTRICS FOR MULTILEVEL METALLIZATION | en_US |
| dc.type | Proceedings Paper | en_US |
Files
License bundle
1 - 1 of 1
Loading...
- Name:
- license.txt
- Size:
- 1.71 KB
- Format:
- Item-specific license agreed to upon submission
- Description: