助聽器微機電晶片系統---總計畫(I)
| dc.contributor.author | 吳介琮 | en_US |
| dc.contributor.author | WU JIEH-TSORNG | en_US |
| dc.contributor.department | 交通大學電子工程系 | zh_TW |
| dc.date.accessioned | 2014-12-13T10:29:17Z | |
| dc.date.available | 2014-12-13T10:29:17Z | |
| dc.date.issued | 2006 | en_US |
| dc.description.sponsorship | 行政院國家科學委員會 | zh_TW |
| dc.identifier.govdoc | NSC95-2220-E009-021 | zh_TW |
| dc.identifier.uri | https://www.grb.gov.tw/search/planDetail?id=1279626&docId=234490 | en_US |
| dc.identifier.uri | https://ir.lib.nycu.edu.tw/handle/11536/89069 | |
| dc.language.iso | zh_TW | en_US |
| dc.title | 助聽器微機電晶片系統---總計畫(I) | zh_TW |
| dc.title | MEMS SoC for Hearing Aids(I) | en_US |
| dc.type | Plan | en_US |
Files
License bundle
1 - 1 of 1
Loading...
- Name:
- license.txt
- Size:
- 1.71 KB
- Format:
- Item-specific license agreed to upon submission
- Description: