電磁干擾下金屬空腔內印刷電路之電磁耦合分析與模擬
| dc.contributor.author | 黃瑞彬 | en_US |
| dc.contributor.author | HWANG RUEY BING | en_US |
| dc.contributor.department | 國立交通大學電信工程學系(所) | zh_TW |
| dc.date.accessioned | 2014-12-13T10:32:33Z | |
| dc.date.available | 2014-12-13T10:32:33Z | |
| dc.date.issued | 2004 | en_US |
| dc.description.sponsorship | 行政院國家科學委員會 | zh_TW |
| dc.identifier.govdoc | NSC93-2623-7009-017 | zh_TW |
| dc.identifier.uri | https://www.grb.gov.tw/search/planDetail?id=902707&docId=171632 | en_US |
| dc.identifier.uri | https://ir.lib.nycu.edu.tw/handle/11536/91611 | |
| dc.language.iso | zh_TW | en_US |
| dc.title | 電磁干擾下金屬空腔內印刷電路之電磁耦合分析與模擬 | zh_TW |
| dc.title | Investigation on the Electromagnetic Interference on Printed Circuit Board in a Metal Cavity | en_US |
| dc.type | Plan | en_US |