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開發新式骨導式人工耳蝸---子計畫三:骨導式人工耳蝸之可程式化低能耗數位訊號處理器設計( III )

dc.contributor.author楊家驤en_US
dc.contributor.authorYang Chia-Hsiangen_US
dc.contributor.department國立交通大學電子工程學系及電子研究所zh_TW
dc.date.accessioned2014-12-13T10:49:46Z
dc.date.available2014-12-13T10:49:46Z
dc.date.issued2014en_US
dc.description.sponsorship科技部zh_TW
dc.identifier.govdocNSC103-2220-E009-002zh_TW
dc.identifier.urihttps://www.grb.gov.tw/search/planDetail?id=8262706&docId=437254en_US
dc.identifier.urihttps://ir.lib.nycu.edu.tw/handle/11536/101822
dc.language.isozh_TWen_US
dc.title開發新式骨導式人工耳蝸---子計畫三:骨導式人工耳蝸之可程式化低能耗數位訊號處理器設計( III )zh_TW
dc.titleEnergy-Efficient Reconfigurable DSP Processors for the Bone-Guided Cochlear Prosthesis( III )en_US
dc.typePlanen_US

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