超大型積體電路中連接導線之銅材及障礙層微結構及特性研究
| dc.contributor.author | 張立 | en_US |
| dc.contributor.author | CHANG LI | en_US |
| dc.contributor.department | 交通大學材料科學與工程研究所 | zh_TW |
| dc.date.accessioned | 2014-12-13T10:37:12Z | |
| dc.date.available | 2014-12-13T10:37:12Z | |
| dc.date.issued | 1999 | en_US |
| dc.description.sponsorship | 行政院國家科學委員會 | zh_TW |
| dc.identifier.govdoc | NSC88-2215-E009-027 | zh_TW |
| dc.identifier.uri | https://www.grb.gov.tw/search/planDetail?id=444285&docId=80462 | en_US |
| dc.identifier.uri | https://ir.lib.nycu.edu.tw/handle/11536/94455 | |
| dc.language.iso | zh_TW | en_US |
| dc.subject | 金屬化 | zh_TW |
| dc.subject | 擴散阻礙 | zh_TW |
| dc.subject | 濺鍍 | zh_TW |
| dc.subject | 銅 | zh_TW |
| dc.subject | Metallization | en_US |
| dc.subject | Diffusion barrier | en_US |
| dc.subject | Sputtering | en_US |
| dc.subject | Copper | en_US |
| dc.title | 超大型積體電路中連接導線之銅材及障礙層微結構及特性研究 | zh_TW |
| dc.title | Microstructural Study of Copper and Its Alloys for Interconnect Application in ULSI | en_US |
| dc.type | Plan | en_US |