晶圓封裝打線製程之電腦視覺檢測與品質管制研究(I)
| dc.contributor.author | 彭德保 | en_US |
| dc.contributor.author | PERNG DER-BAAU | en_US |
| dc.contributor.department | 國立交通大學工業工程與管理學系 | zh_TW |
| dc.date.accessioned | 2014-12-13T10:33:02Z | |
| dc.date.available | 2014-12-13T10:33:02Z | |
| dc.date.issued | 2003 | en_US |
| dc.description.sponsorship | 行政院國家科學委員會 | zh_TW |
| dc.identifier.govdoc | NSC92-2213-E009-103 | zh_TW |
| dc.identifier.uri | https://www.grb.gov.tw/search/planDetail?id=843508&docId=159796 | en_US |
| dc.identifier.uri | https://ir.lib.nycu.edu.tw/handle/11536/91839 | |
| dc.language.iso | zh_TW | en_US |
| dc.title | 晶圓封裝打線製程之電腦視覺檢測與品質管制研究(I) | zh_TW |
| dc.title | Vision Inspection and SPC Study for Wafer Wire-Bond Packaging (I) | en_US |
| dc.type | Plan | en_US |