HEAT CONDUCTING MODULE
| dc.citation.patentcountry | USA | en_US |
| dc.citation.patentnumber | 20170064866 | en_US |
| dc.contributor.author | Chi-Chuan WANG | en_US |
| dc.contributor.author | Kuo-Wei LIN | en_US |
| dc.date.accessioned | 2019-04-11T05:42:34Z | |
| dc.date.available | 2019-04-11T05:42:34Z | |
| dc.date.issued | 2017-03-02 | en_US |
| dc.description.abstract | A heat conducting module includes a main body. The main body includes a first surface and a second surface. The first surface is thermally connected to a heat absorbing body. The second surface is opposite to the first surface and is fluidly connected to a channel. The second surface has a plurality of grooves disposed along a direction. The channel allows a fluid to flow a long the direction. Each of the grooves includes a first sub-groove and at least one second sub-groove. The first sub-groove at least has a third surface close to the first surface. The first sub-groove at least partially communicates with the second sub-groove, and the second sub-groove is at least partially fluidly connected with the third surface. | en_US |
| dc.identifier.govdoc | H05K007/20 | en_US |
| dc.identifier.uri | https://ir.lib.nycu.edu.tw/handle/11536/151256 | |
| dc.language.iso | en_US | en_US |
| dc.title | HEAT CONDUCTING MODULE | en_US |
| dc.type | Patents | en_US |