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A Low-Power Wireless Bondwire Inertial Sensor System

dc.citation.epage473en_US
dc.citation.spage470en_US
dc.citation.woscount0en_US
dc.contributor.authorHuang, Shih-Chiehen_US
dc.contributor.authorLu, Shao-Yungen_US
dc.contributor.authorCheng, Fu-Yuanen_US
dc.contributor.authorTsai, Tsung-Hengen_US
dc.contributor.authorLiao, Yu-Teen_US
dc.contributor.department電機學院zh_TW
dc.contributor.departmentCollege of Electrical and Computer Engineeringen_US
dc.date.accessioned2017-04-21T06:49:17Z
dc.date.available2017-04-21T06:49:17Z
dc.date.issued2015en_US
dc.description.abstractThis paper presents the design and implementation of a fully-integrated CMOS accelerometer using bondwires as sensing devices without Micro Electro-Mechanical Systems (MEMS) processes. The model and analysis of bondwire inertial sensors are provided for further implementation of low-power and low-noise accelerometers. Finite element method (FEM) simulation is performed to verify the concept and model. This paper also proposes a closed-loop readout interface that suppresses the in-band noise and reduces both design complexity and power consumption. The bondwire accelerometer is fabricated in a 0.18 mu m CMOS process, achieves a 33 mV/g linear transducer gain within a 5 kHz bandwidth, and consumes 9 mW.en_US
dc.identifier.isbn978-1-4799-8203-5en_US
dc.identifier.issn1930-0395en_US
dc.identifier.journal2015 IEEE SENSORSen_US
dc.identifier.urihttps://ir.lib.nycu.edu.tw/handle/11536/135966
dc.identifier.wosnumberWOS:000380440800122en_US
dc.language.isoen_USen_US
dc.subjectBondwireen_US
dc.subjectAccelerometeren_US
dc.subjectInertial sensoren_US
dc.subjectCMOS integrationen_US
dc.titleA Low-Power Wireless Bondwire Inertial Sensor Systemen_US
dc.typeProceedings Paperen_US

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