發光元件封裝結構
| dc.citation.patentcountry | TWN | en_US |
| dc.citation.patentnumber | 201707242 | en_US |
| dc.contributor.author | 林建中 | zh_TW |
| dc.contributor.author | 郭浩中 | zh_TW |
| dc.contributor.author | 佘慶威 | zh_TW |
| dc.contributor.author | 韓皓惟 | zh_TW |
| dc.contributor.author | 陳國儒 | zh_TW |
| dc.contributor.author | 凃宗逸 | zh_TW |
| dc.contributor.author | 塗軒豪 | zh_TW |
| dc.date.accessioned | 2019-04-11T05:51:21Z | |
| dc.date.available | 2019-04-11T05:51:21Z | |
| dc.date.issued | 2017-02-16 | en_US |
| dc.description.abstract | 本發明提供一種發光元件封裝結構，其包含基板、發光元件陣列、封膠層、散射粒子以及螢光材料層。發光元件陣列位於基板上。封膠層覆蓋發光二極體陣列。散射粒子散佈於封膠層中。螢光材料層位於封膠層上。 | zh_TW |
| dc.identifier.govdoc | H01L033/50 | en_US |
| dc.identifier.govdoc | H01L033/48 | en_US |
| dc.identifier.uri | https://ir.lib.nycu.edu.tw/handle/11536/151325 | |
| dc.language.iso | zh_TW | en_US |
| dc.title | 發光元件封裝結構 | zh_TW |
| dc.type | Patents | en_US |