Low Temperature Cu-to-Cu Direct Bonding with thin gold capping on Highly-orientated Nanotwinned Cu Films
| dc.citation.epage | 51 | en_US |
| dc.citation.spage | 51 | en_US |
| dc.citation.woscount | 0 | en_US |
| dc.contributor.author | Chen, Fu-Chian | en_US |
| dc.contributor.author | Wu, Yu-Ting | en_US |
| dc.contributor.author | Chen, Chih | en_US |
| dc.contributor.department | 材料科學與工程學系 | zh_TW |
| dc.contributor.department | Department of Materials Science and Engineering | en_US |
| dc.date.accessioned | 2019-12-13T01:12:49Z | |
| dc.date.available | 2019-12-13T01:12:49Z | |
| dc.date.issued | 2019-01-01 | en_US |
| dc.description.abstract | In this study, we capped gold on the surface of highly (111)-orientated nano-twin copper films. With the great diffusivity of (111) copper and the low activity in gold, we can achieve a lower bonding temperature. | en_US |
| dc.identifier.isbn | 978-4-904743-07-2 | en_US |
| dc.identifier.journal | PROCEEDINGS OF 2019 6TH INTERNATIONAL WORKSHOP ON LOW TEMPERATURE BONDING FOR 3D INTEGRATION (LTB-3D) | en_US |
| dc.identifier.uri | https://ir.lib.nycu.edu.tw/handle/11536/153260 | |
| dc.identifier.wosnumber | WOS:000492018300051 | en_US |
| dc.language.iso | en_US | en_US |
| dc.title | Low Temperature Cu-to-Cu Direct Bonding with thin gold capping on Highly-orientated Nanotwinned Cu Films | en_US |
| dc.type | Proceedings Paper | en_US |
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