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High Performance RF Passive Devices and Noise-Shielding MOSFET on IC-Standard Si Wafer for Sub-THz Applications

dc.citation.epage109en_US
dc.citation.spage107en_US
dc.contributor.authorChin, Alberten_US
dc.contributor.authorKao, Hsuan-Lingen_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.date.accessioned2014-12-08T15:34:48Z
dc.date.available2014-12-08T15:34:48Z
dc.date.issued2013en_US
dc.description.abstractThe operation frequency of a MOSFET is approaching THz as continuously scaling down into 1X nm. Nevertheless, the very high power loss of transmission line on IC-Standard Si wafer (similar to 5 dB/mm at 110 GHz) is the fundamental limitation for Si-based sub-THz IC. Using a simple method to translate standard 10 Omega-cm low resistivity into semi-insulating, very low loss transmission line and broad filters have been realized on Si wafer to 110 GHz, with performance near ideal devices by EM design. The noise coupling of CPW-layout RF MOSFET can also be filtered using a microstrip line design, and a low min. noise figure (NFmin) of 0.5 dB at 10 GHz was measured in a 90 nm MOSFET.en_US
dc.identifier.isbn978-1-4799-1472-2en_US
dc.identifier.journal2013 ASIA-PACIFIC MICROWAVE CONFERENCE PROCEEDINGS (APMC 2013)en_US
dc.identifier.urihttps://ir.lib.nycu.edu.tw/handle/11536/23698
dc.identifier.wosnumberWOS:000330851900035
dc.language.isoen_USen_US
dc.subjecttransmission lineen_US
dc.subjectfilteren_US
dc.subjectpower lossen_US
dc.subjectnoise figureen_US
dc.subjectTHzen_US
dc.subjectMOSFETen_US
dc.subjectSien_US
dc.subjectICen_US
dc.titleHigh Performance RF Passive Devices and Noise-Shielding MOSFET on IC-Standard Si Wafer for Sub-THz Applicationsen_US
dc.typeProceedings Paperen_US

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