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Surface reaction of bis(tertbutylimido)bis(diethylamido)tungsten precursor on Si(100)-(2X1)

dc.citation.epage1624en_US
dc.citation.issue5en_US
dc.citation.spage1620en_US
dc.citation.volume21en_US
dc.contributor.authorWu, JBen_US
dc.contributor.authorYang, YWen_US
dc.contributor.authorLin, YFen_US
dc.contributor.authorChiu, HTen_US
dc.contributor.department應用化學系zh_TW
dc.contributor.departmentDepartment of Applied Chemistryen_US
dc.date.accessioned2014-12-08T15:40:27Z
dc.date.available2014-12-08T15:40:27Z
dc.date.issued2003-09-01en_US
dc.description.abstractThermal decomposition of a metal-organic chemical vapor deposition precursor, (t-BuN=)(2)W(-NEt2)(2), (bis(tertbutylimido)bis(diethylamido)tungsten, on Si(100) has been studied by means of synchrotron radiation-based x-ray photoemission spectroscopy and temperature programmed desorption spectroscopy. The, resultant thin films consist of tungsten metal, silicon carbides and silicon nitrides. Major desorption products, originated from ligand decomposition include imine (C2H5N=CHCH3) that is derived from beta-H elimination of diethylamido ligand, and isobutene (C4H8) that is generated from gamma-H elimination of t-butylimido ligands. The. transmetalation of the precursor leads to tungsten metal adsorption on Si(100); by contrast, tungsten nitrides, tungsten carbides and tungsten oxides are produced as the same precursor is decomposed on SiO2 surface. (C) 2003 American Vacuum Society.en_US
dc.identifier.doi10.1116/1.1593050en_US
dc.identifier.issn0734-2101en_US
dc.identifier.journalJOURNAL OF VACUUM SCIENCE & TECHNOLOGY Aen_US
dc.identifier.urihttp://dx.doi.org/10.1116/1.1593050en_US
dc.identifier.urihttps://ir.lib.nycu.edu.tw/handle/11536/27614
dc.identifier.wosnumberWOS:000185608100011
dc.language.isoen_USen_US
dc.titleSurface reaction of bis(tertbutylimido)bis(diethylamido)tungsten precursor on Si(100)-(2X1)en_US
dc.typeArticle; Proceedings Paperen_US

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