積體電路化學品與材料之開發---子計畫VI：積體電路封裝用聚亞醯胺納米複合材料材機械及電氣性質之研究(II)

dc.contributor.author	韋光華	en_US
dc.contributor.author	KUNG-HWAWEI	en_US
dc.contributor.department	交通大學材料科學與工程研究所	zh_TW
dc.date.accessioned	2014-12-13T10:36:44Z
dc.date.available	2014-12-13T10:36:44Z
dc.date.issued	1999	en_US
dc.description.sponsorship	行政院國家科學委員會	zh_TW
dc.identifier.govdoc	NSC88-CPC-E009-007	zh_TW
dc.identifier.uri	https://www.grb.gov.tw/search/planDetail?id=460500&docId=84321	en_US
dc.identifier.uri	https://ir.lib.nycu.edu.tw/handle/11536/94133
dc.language.iso	zh_TW	en_US
dc.subject	聚亞醯胺	zh_TW
dc.subject	納米複合材料	zh_TW
dc.subject	積體電路	zh_TW
dc.subject	構裝	zh_TW
dc.subject	機械性質	zh_TW
dc.subject	Polyimide	en_US
dc.subject	Nanocomposite	en_US
dc.subject	Integrated circuit	en_US
dc.subject	Packaging	en_US
dc.subject	Mechanical property	en_US
dc.title	積體電路化學品與材料之開發---子計畫VI：積體電路封裝用聚亞醯胺納米複合材料材機械及電氣性質之研究(II)	zh_TW
dc.title	A Study on the Mechanical and Electrical Properties of Polyimide Nancomposites for Integrated Circuit Packaging Application (II)	en_US
dc.type	Plan	en_US

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