60GHZ傳送接收器之覆晶多晶片模組構裝技術與設備開發計畫第二期(III)
| dc.contributor.author | 成維華 | en_US |
| dc.contributor.author | CHIENG WEI-HUA | en_US |
| dc.contributor.department | 國立交通大學機械工程學系(所) | zh_TW |
| dc.date.accessioned | 2014-12-13T10:46:57Z | |
| dc.date.available | 2014-12-13T10:46:57Z | |
| dc.date.issued | 2009 | en_US |
| dc.description.sponsorship | 行政院國家科學委員會 | zh_TW |
| dc.identifier.govdoc | NSC98-2623-E009-004-IT | zh_TW |
| dc.identifier.uri | https://www.grb.gov.tw/search/planDetail?id=1843770&docId=305705 | en_US |
| dc.identifier.uri | https://ir.lib.nycu.edu.tw/handle/11536/100928 | |
| dc.language.iso | zh_TW | en_US |
| dc.title | 60GHZ傳送接收器之覆晶多晶片模組構裝技術與設備開發計畫第二期(III) | zh_TW |
| dc.type | Plan | en_US |
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