ON-CHIP ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME
| dc.citation.patentcountry | USA | zh_TW |
| dc.citation.patentnumber | 20120235275 | zh_TW |
| dc.contributor.author | CHENG YU-TING | en_US |
| dc.contributor.author | CHAO TZU-YUAN | en_US |
| dc.contributor.author | CHEN KUAN-MING | en_US |
| dc.contributor.author | HSU HSIN-FU | en_US |
| dc.date.accessioned | 2014-12-16T06:15:06Z | |
| dc.date.available | 2014-12-16T06:15:06Z | |
| dc.date.issued | 2012-09-20 | en_US |
| dc.description.abstract | The present invention relates to an on-chip electronic device and a method for manufacturing the same. The on-chip electronic device according to the present invention comprises a substrate, a porous layer, a plurality of magnetic bodies, and an electronic member layer. The porous layer is disposed on the substrate and has a plurality of voids; each of the plurality of magnetic bodies is disposed in the plurality of voids, respectively; and the electronic member layer is disposed on one side of the porous layer, such as upper side of or lower sider of the porous layer. Because the plurality of magnetic bodies is used as the core of the inductance, the inductance is increased effectively and the area of the on-chip electronic device is reduced. Besides the manufacturing method according to the present invention is simple and compatible with the current CMOS process, the manufacturing cost can be lowered. | zh_TW |
| dc.identifier.govdoc | H01L029/86 | zh_TW |
| dc.identifier.govdoc | H01L021/02 | zh_TW |
| dc.identifier.uri | https://ir.lib.nycu.edu.tw/handle/11536/105131 | |
| dc.language.iso | zh_TW | en_US |
| dc.title | ON-CHIP ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME | zh_TW |
| dc.type | Patents | en_US |