Enhancement of CMOS THz Imaging Sensing By Packaging Technology

dc.citation.epage	24	en_US
dc.citation.spage	22	en_US
dc.contributor.author	Kuo, Chien-Nan	en_US
dc.contributor.author	Chen, Wei-Cheng	en_US
dc.contributor.author	Chiu, Te-Yen	en_US
dc.contributor.author	Li, Chun-Hsing	en_US
dc.contributor.department	電子工程學系及電子研究所	zh_TW
dc.contributor.department	Department of Electronics Engineering and Institute of Electronics	en_US
dc.date.accessioned	2018-08-21T05:57:07Z
dc.date.available	2018-08-21T05:57:07Z
dc.date.issued	2017-01-01	en_US
dc.description.abstract	Terahertz imaging sensing provides numerous attractive applications in different areas, for example, biology and medicine. CMOS technology benefits an imaging system in low cost and a small form factor. The technology advance is technically viable for circuit design in such high frequencies. Lossy silicon substrate, however, still degrades system performance. We will discuss the techniques of performance enhancement.	en_US
dc.identifier.journal	2017 IEEE INTERNATIONAL SYMPOSIUM ON RADIO-FREQUENCY INTEGRATION TECHNOLOGY (RFIT)	en_US
dc.identifier.uri	https://ir.lib.nycu.edu.tw/handle/11536/147069
dc.identifier.wosnumber	WOS:000426966800008	en_US
dc.language.iso	en_US	en_US
dc.subject	CMOS	en_US
dc.subject	THz	en_US
dc.subject	imaging system	en_US
dc.subject	3D	en_US
dc.subject	switch	en_US
dc.subject	dielectric resonator	en_US
dc.title	Enhancement of CMOS THz Imaging Sensing By Packaging Technology	en_US
dc.type	Proceedings Paper	en_US

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