STUDY OF NANO-TWINNED CU PREPARED BY LOW-TEMPERATURE ELECTRODEPOSITION AND ITS THERMAL STABILITY
| dc.citation.epage | 138 | en_US |
| dc.citation.spage | 135 | en_US |
| dc.citation.woscount | 0 | en_US |
| dc.contributor.author | Chen, Yen-Chieh | en_US |
| dc.contributor.author | Chen, Chih | en_US |
| dc.contributor.department | 材料科學與工程學系 | zh_TW |
| dc.contributor.department | Department of Materials Science and Engineering | en_US |
| dc.date.accessioned | 2017-04-21T06:49:18Z | |
| dc.date.available | 2017-04-21T06:49:18Z | |
| dc.date.issued | 2016 | en_US |
| dc.identifier.isbn | 978-1-5090-4769-7 | en_US |
| dc.identifier.issn | 2150-5934 | en_US |
| dc.identifier.journal | 2016 11TH INTERNATIONAL MICROSYSTEMS, PACKAGING, ASSEMBLY AND CIRCUITS TECHNOLOGY CONFERENCE (IMPACT-IAAC 2016) | en_US |
| dc.identifier.uri | https://ir.lib.nycu.edu.tw/handle/11536/134597 | |
| dc.identifier.wosnumber | WOS:000391819600027 | en_US |
| dc.language.iso | en_US | en_US |
| dc.title | STUDY OF NANO-TWINNED CU PREPARED BY LOW-TEMPERATURE ELECTRODEPOSITION AND ITS THERMAL STABILITY | en_US |
| dc.type | Proceedings Paper | en_US |
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