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Parameter extraction of resistive thermal sensors

dc.citation.epage47en_US
dc.citation.issue1en_US
dc.citation.spage43en_US
dc.citation.volume55en_US
dc.contributor.authorChen, YMen_US
dc.contributor.authorShie, JSen_US
dc.contributor.authorHwang, Ten_US
dc.contributor.department交大名義發表zh_TW
dc.contributor.department光電工程學系zh_TW
dc.contributor.departmentNational Chiao Tung Universityen_US
dc.contributor.departmentDepartment of Photonicsen_US
dc.date.accessioned2014-12-08T15:02:30Z
dc.date.available2014-12-08T15:02:30Z
dc.date.issued1996-07-15en_US
dc.description.abstractObtaining thermal parameters is important in evaluating the performance of thermal microsensors. Two experimental methods are described here for the study of the pressure-dependent thermal behavior of the sensors: a bolometric method that utilizes a chopped light input to obtain a sensor frequency response, and deriving its thermal data therefrom; a d.c, electrical method that measures the heat required for balance under d.c. bias, and obtaining sensor information. The thermal conductance and capacitance, absorptance, as well as emissivity of a sensor can be extracted from the experimental measurements. These parameters provide the essential data for the electrothermal SPICE program in the related design simulations.en_US
dc.identifier.doi10.1016/S0924-4247(96)01248-4en_US
dc.identifier.issn0924-4247en_US
dc.identifier.journalSENSORS AND ACTUATORS A-PHYSICALen_US
dc.identifier.urihttp://dx.doi.org/10.1016/S0924-4247(96)01248-4en_US
dc.identifier.urihttps://ir.lib.nycu.edu.tw/handle/11536/1167
dc.identifier.wosnumberWOS:A1996VY35800009
dc.language.isoen_USen_US
dc.subjectthermal sensorsen_US
dc.subjectparameter extractionen_US
dc.subjectbolometric methoden_US
dc.subjectdc methoden_US
dc.titleParameter extraction of resistive thermal sensorsen_US
dc.typeArticle; Proceedings Paperen_US

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