INTERCONNECTING STRUCTURE FOR ELECTRICALLY CONNECTING A FIRST ELECTRONIC DEVICE WITH A SECOND ELECTRONIC DEVICE
| dc.citation.patentcountry | USA | zh_TW |
| dc.citation.patentnumber | 20150068024 | zh_TW |
| dc.contributor.author | Li Chun-Hsing | en_US |
| dc.contributor.author | Kuo Chien-Nan | en_US |
| dc.contributor.author | Ko Chun-Lin | en_US |
| dc.date.accessioned | 2015-05-12T02:59:51Z | |
| dc.date.available | 2015-05-12T02:59:51Z | |
| dc.date.issued | 2015-03-12 | en_US |
| dc.description.abstract | An interconnecting structure for electrically connecting a first electronic device with a second electronic device is provided. The first electronic device has two first bond-pads, and the second electronic device has two second bond-pads electrically connected to the two first bond-pads respectively. The interconnecting structure includes a signal transmission structure electrically connected to the two first bond-pads and the two second bond-pads; and a ground device disposed between the first electronic device and the second electronic device so that the first electronic device and the second electronic device have a same ground potential. | zh_TW |
| dc.identifier.govdoc | H01P003/08 | zh_TW |
| dc.identifier.uri | https://ir.lib.nycu.edu.tw/handle/11536/122862 | |
| dc.language.iso | zh_TW | en_US |
| dc.title | INTERCONNECTING STRUCTURE FOR ELECTRICALLY CONNECTING A FIRST ELECTRONIC DEVICE WITH A SECOND ELECTRONIC DEVICE | zh_TW |
| dc.type | Patents | en_US |