<link rel="stylesheet" href="styles.cf390c6bfbe7555f.css"> Skip to main content

Demonstration of Implantable Grid Electrode/3-Dimensional Probe Array for ECOG and Extracellular Neural Recording on Rat

dc.citation.epage85en_US
dc.citation.spage85en_US
dc.contributor.authorChou, Lei-Chunen_US
dc.contributor.authorChang, Chih-Weien_US
dc.contributor.authorChiou, Jin-Chernen_US
dc.contributor.department電機工程學系zh_TW
dc.contributor.departmentDepartment of Electrical and Computer Engineeringen_US
dc.date.accessioned2014-12-08T15:30:04Z
dc.date.available2014-12-08T15:30:04Z
dc.date.issued2012en_US
dc.description.abstractThis demonstration presents implantable grid electrodes array and three dimensional microprobe array for neural sensing on free-behaved laboratory rats. A flexible grid electrode array is fabricated for ECoG signal acquiring brain surface signal with 12-um thick parylene-C substrate and platinum sensing electrode. Flexible electrode array provides perfectly fitted to brain surface curvature. The 3D probe array are fabricated by MEMS process with new stacking method for 3D biopotential acquisition in the implanted target volume of tissue. Practical in-vivo recordings including auditory response, brain resection tissue and PZT-induced seizures recording demonstrate the correct function of the proposed neural recording devices.en_US
dc.identifier.isbn978-1-4673-2293-5en_US
dc.identifier.issn2163-4025en_US
dc.identifier.journal2012 IEEE BIOMEDICAL CIRCUITS AND SYSTEMS CONFERENCE (BIOCAS): INTELLIGENT BIOMEDICAL ELECTRONICS AND SYSTEM FOR BETTER LIFE AND BETTER ENVIRONMENTen_US
dc.identifier.urihttps://ir.lib.nycu.edu.tw/handle/11536/21539
dc.identifier.wosnumberWOS:000316563200028
dc.language.isoen_USen_US
dc.titleDemonstration of Implantable Grid Electrode/3-Dimensional Probe Array for ECOG and Extracellular Neural Recording on Raten_US
dc.typeProceedings Paperen_US

Files

License bundle

Now showing 1 - 1 of 1
Loading...
Thumbnail Image
Name:
license.txt
Size:
1.71 KB
Format:
Item-specific license agreed to upon submission
Description: