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低漏電之氮化鋁介電層的製造方法

dc.citation.patentcountryTWNzh_TW
dc.citation.patentnumber200839874zh_TW
dc.contributor.author顏國錫en_US
dc.contributor.author冉曉雯en_US
dc.contributor.author黃振昌en_US
dc.contributor.author陳建勳en_US
dc.contributor.author葉峻銘en_US
dc.contributor.author劉薄寬en_US
dc.contributor.author古國欣en_US
dc.date.accessioned2014-12-16T06:12:59Z
dc.date.available2014-12-16T06:12:59Z
dc.date.issued2008-10-01en_US
dc.description.abstract一種低漏電之氮化鋁介電層的製造方法,利用鋁鈀、氮氣與氬氣濺鍍氮化鋁薄膜作為高疏水性的介電層,此氮化鋁介電層具低閘極漏電及高介電係數等特質,適合作為薄膜電晶體的閘極絕緣層,而本發明利用調整沉積薄膜時的氣體混合比例,來抑制氮化鋁介電層的漏電,而可在低溫的條件下成長高品質的氮化鋁介電層,並可製作出低電壓的高效能電晶體。zh_TW
dc.identifier.govdocH01L021/318zh_TW
dc.identifier.govdocH01L051/40zh_TW
dc.identifier.urihttps://ir.lib.nycu.edu.tw/handle/11536/103950
dc.language.isozh_TWen_US
dc.title低漏電之氮化鋁介電層的製造方法zh_TW
dc.typePatentsen_US

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