以微電鍍法製作次微米孔穴的研究
| dc.contributor.author | 徐文祥 | en_US |
| dc.contributor.author | HSU WENSYANG | en_US |
| dc.contributor.department | 國立交通大學機械工程學系 | zh_TW |
| dc.date.accessioned | 2014-12-13T10:35:43Z | |
| dc.date.available | 2014-12-13T10:35:43Z | |
| dc.date.issued | 2001 | en_US |
| dc.description.sponsorship | 行政院國家科學委員會 | zh_TW |
| dc.identifier.govdoc | NSC90-2212-E009-033 | zh_TW |
| dc.identifier.uri | https://www.grb.gov.tw/search/planDetail?id=645475&docId=121268 | en_US |
| dc.identifier.uri | https://ir.lib.nycu.edu.tw/handle/11536/93556 | |
| dc.language.iso | zh_TW | en_US |
| dc.subject | 微電鍍 | zh_TW |
| dc.subject | 次微米孔穴 | zh_TW |
| dc.subject | 製造 | zh_TW |
| dc.subject | Micro electroplating | en_US |
| dc.subject | Sub-micro aperture | en_US |
| dc.subject | Fabrication | en_US |
| dc.title | 以微電鍍法製作次微米孔穴的研究 | zh_TW |
| dc.title | Fabrication of Sub-Micro Aperture by Micro Electroplating | en_US |
| dc.type | Plan | en_US |
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