晶圓級封裝方法與封裝結構
| dc.citation.patentcountry | TWN | zh_TW |
| dc.citation.patentnumber | I455259 | zh_TW |
| dc.contributor.author | 陳宗麟 | en_US |
| dc.contributor.author | 練瑞虔 | en_US |
| dc.date.accessioned | 2014-12-16T06:16:46Z | |
| dc.date.available | 2014-12-16T06:16:46Z | |
| dc.date.issued | 2014-10-01 | en_US |
| dc.identifier.govdoc | H01L023/28 | zh_TW |
| dc.identifier.govdoc | H01L023/52 | zh_TW |
| dc.identifier.uri | https://ir.lib.nycu.edu.tw/handle/11536/106061 | |
| dc.language.iso | zh_TW | en_US |
| dc.title | 晶圓級封裝方法與封裝結構 | zh_TW |
| dc.type | Patents | en_US |