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Sub-wavelength structure layer, method for fabricating the same and photoelectric conversion device applying the same

dc.citation.patentcountryUSAzh_TW
dc.citation.patentnumber20110146779zh_TW
dc.contributor.authorChang Edward Yien_US
dc.contributor.authorSahoo Kartika Chandraen_US
dc.contributor.authorLin Men-Kuen_US
dc.contributor.authorLu Yi-Yaoen_US
dc.contributor.authorWang Sheng-Pingen_US
dc.date.accessioned2014-12-16T06:15:25Z
dc.date.available2014-12-16T06:15:25Z
dc.date.issued2011-06-23en_US
dc.description.abstractThe present invention relates to a method for fabricating a sub-wavelength structure layer, including: forming a metal film on a passivation layer, an n-GaN layer or a transparent conductive oxide layer; performing thermal treatment to form self assembled metal nano particles; using the metal nano particles as a mask to remove a partial area of the passivation layer, the n-GaN layer or the transparent conductive oxide layer to form a sub-wavelength structure of which the cross-sectional area increases along the thickness direction of the passivation layer, the n-GaN layer or the transparent conductive oxide layer; and removing the metal nano particles. In addition, the present invention further provides the obtained sub-wavelength structure layer and a photoelectric conversion device using the same.zh_TW
dc.identifier.govdocH01L031/0224zh_TW
dc.identifier.govdocH01L031/18zh_TW
dc.identifier.govdocH01L031/0352zh_TW
dc.identifier.urihttps://ir.lib.nycu.edu.tw/handle/11536/105296
dc.language.isozh_TWen_US
dc.titleSub-wavelength structure layer, method for fabricating the same and photoelectric conversion device applying the samezh_TW
dc.typePatentsen_US

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