Low-Cost Embedded RRAM Technology for System-on-Plastic Integration Using a-IGZO TFTs

dc.citation.epage74en_US
dc.citation.spage71en_US
dc.contributor.authorHou, Tuo-Hungen_US
dc.contributor.authorWu, Shih-Chiehen_US
dc.contributor.authorYu, Ming-Jiueen_US
dc.contributor.authorLiu, Pang-Shiuanen_US
dc.contributor.authorChi, Li-Jenen_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.date.accessioned2014-12-08T15:36:01Z
dc.date.available2014-12-08T15:36:01Z
dc.date.issued2013en_US
dc.description.abstractThis paper discusses the recent progress of a-IGZO TFTs for both high-performance logic and nonvolatile memory applications using an identical device structure, which opens up new opportunities of low-cost embedded memory for system-on-plastic integration. Using localized, independent, and multi-level resistive switching in a-IGZO TFTs, several compact memory array architectures with extremely high bit density have been proposed.en_US
dc.identifier.isbn978-4-86348-311-8en_US
dc.identifier.journalPROCEEDINGS OF 2013 TWENTIETH INTERNATIONAL WORKSHOP ON ACTIVE-MATRIX FLATPANEL DISPLAYS AND DEVICES (AM-FPD 13): TFT TECHNOLOGIES AND FPD MATERIALSen_US
dc.identifier.urihttps://ir.lib.nycu.edu.tw/handle/11536/24374
dc.identifier.wosnumberWOS:000335778400019
dc.language.isoen_USen_US
dc.titleLow-Cost Embedded RRAM Technology for System-on-Plastic Integration Using a-IGZO TFTsen_US
dc.typeProceedings Paperen_US

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