Planning yields in recycling test wafers

dc.citation.epage	144	en_US
dc.citation.spage	141	en_US
dc.contributor.author	Wu, MC	en_US
dc.contributor.author	Chien, CS	en_US
dc.contributor.author	Lu, KS	en_US
dc.contributor.department	工業工程與管理學系	zh_TW
dc.contributor.department	Department of Industrial Engineering and Management	en_US
dc.date.accessioned	2014-12-08T15:25:58Z
dc.date.available	2014-12-08T15:25:58Z
dc.date.issued	2004	en_US
dc.description.abstract	This paper formulates a decision problem and proposes two solution methods for selecting the yield improvement alternatives in the test wafer recycle processes. The decision problem is to determine the yield improvement target for each recycle process in order to minimize the use of test wafers.	en_US
dc.identifier.isbn	0-7803-8469-5	en_US
dc.identifier.journal	2004 SEMICONDUCTOR MANUFACTURING TECHNOLOGY WORKSHOP PROCEEDINGS	en_US
dc.identifier.uri	https://ir.lib.nycu.edu.tw/handle/11536/18416
dc.identifier.wosnumber	WOS:000225401500035
dc.language.iso	en_US	en_US
dc.title	Planning yields in recycling test wafers	en_US
dc.type	Proceedings Paper	en_US

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