適用於無線通訊之互補式金氧半積體電路-總計畫
| dc.contributor.author | 吳重雨 | en_US |
| dc.contributor.author | CHUNG-YUWU | en_US |
| dc.contributor.department | 國立交通大學電子工程研究所 | zh_TW |
| dc.date.accessioned | 2014-12-13T10:40:28Z | |
| dc.date.available | 2014-12-13T10:40:28Z | |
| dc.date.issued | 2001 | en_US |
| dc.description.sponsorship | 行政院國家科學委員會 | zh_TW |
| dc.identifier.govdoc | NSC90-2215-E009-115 | zh_TW |
| dc.identifier.uri | https://www.grb.gov.tw/search/planDetail?id=660688&docId=125044 | en_US |
| dc.identifier.uri | https://ir.lib.nycu.edu.tw/handle/11536/97517 | |
| dc.language.iso | zh_TW | en_US |
| dc.subject | 互補式金氧半 | zh_TW |
| dc.subject | 積體電路 | zh_TW |
| dc.subject | 無線通信 | zh_TW |
| dc.subject | CMOS | en_US |
| dc.subject | Integrated circuit | en_US |
| dc.subject | Wireless communication | en_US |
| dc.title | 適用於無線通訊之互補式金氧半積體電路-總計畫 | zh_TW |
| dc.title | CMOS Integrated Circuits for Wireless Communication | en_US |
| dc.type | Plan | en_US |
Files
License bundle
1 - 1 of 1
Loading...
- Name:
- license.txt
- Size:
- 1.71 KB
- Format:
- Item-specific license agreed to upon submission
- Description: