METHOD FOR FABRICATING MICRONEEDLE ARRAY AND METHOD FOR FABRICATING EMBOSSING MOLD OF MICRONEEDLE ARRAY
| dc.citation.patentcountry | USA | zh_TW |
| dc.citation.patentnumber | 20080157427 | zh_TW |
| dc.contributor.author | CHIOU, Jin-Chern | en_US |
| dc.contributor.author | HUNG, Chen-Chun | en_US |
| dc.contributor.author | CHANG, Chih-Wei | en_US |
| dc.date.accessioned | 2014-12-16T06:15:57Z | |
| dc.date.available | 2014-12-16T06:15:57Z | |
| dc.date.issued | 2008-07-03 | en_US |
| dc.description.abstract | The present invention discloses a method for fast fabricating microneedle arrays with an embossing process and a method for fabricating an embossing mold of a microneedle array, wherein a master pattern of a high aspect ratio silicon microneedle array is fabricated with a microelectromechanical technology, and the master pattern is used to fabricate an embossing mold; a thermosetting material is filled into the embossing mold; then, baking, pressing and mold-stripping are undertaken; thereby, disposable solid polymer microneedle arrays can be batch-fabricated. | zh_TW |
| dc.identifier.govdoc | B29C033/40 | zh_TW |
| dc.identifier.uri | https://ir.lib.nycu.edu.tw/handle/11536/105589 | |
| dc.language.iso | zh_TW | en_US |
| dc.title | METHOD FOR FABRICATING MICRONEEDLE ARRAY AND METHOD FOR FABRICATING EMBOSSING MOLD OF MICRONEEDLE ARRAY | zh_TW |
| dc.type | Patents | en_US |