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無線個人通訊系統之研發---子計畫五:微波積體電路用之微小化VCO陶瓷元件(II)

dc.contributor.author林鵬en_US
dc.contributor.authorLIN PANGen_US
dc.contributor.department國立交通大學材料科學工程研究所zh_TW
dc.date.accessioned2014-12-13T10:38:44Z
dc.date.available2014-12-13T10:38:44Z
dc.date.issued1996en_US
dc.description.sponsorship行政院國家科學委員會zh_TW
dc.identifier.govdocNSC85-2221-E009-032zh_TW
dc.identifier.urihttps://www.grb.gov.tw/search/planDetail?id=249353&docId=46015en_US
dc.identifier.urihttps://ir.lib.nycu.edu.tw/handle/11536/95624
dc.language.isozh_TWen_US
dc.subject微波zh_TW
dc.subject陶瓷材料zh_TW
dc.subject介電性質zh_TW
dc.subject陶瓷積體微波元件zh_TW
dc.subject行動通訊zh_TW
dc.subjectMicrowaveen_US
dc.subjectCeramic materialen_US
dc.subjectDielectric propertyen_US
dc.subjectCeramic integrated microwavedeviceen_US
dc.subjectMobile communicationen_US
dc.title無線個人通訊系統之研發---子計畫五:微波積體電路用之微小化VCO陶瓷元件(II)zh_TW
dc.titleMiniaturized VCO Ceramic Device for Microwave Integrated Circuits(II)en_US
dc.typePlanen_US

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