銅導線及其障礙層之材質研究(II)
| dc.contributor.author | 張立 | en_US |
| dc.contributor.author | CHANG LI | en_US |
| dc.contributor.department | 國立交通大學材料科學工程研究所 | zh_TW |
| dc.date.accessioned | 2014-12-13T10:36:03Z | |
| dc.date.available | 2014-12-13T10:36:03Z | |
| dc.date.issued | 2000 | en_US |
| dc.description.sponsorship | 行政院國家科學委員會 | zh_TW |
| dc.identifier.govdoc | NSC89-2218-E009-068 | zh_TW |
| dc.identifier.uri | https://www.grb.gov.tw/search/planDetail?id=597337&docId=112563 | en_US |
| dc.identifier.uri | https://ir.lib.nycu.edu.tw/handle/11536/93730 | |
| dc.language.iso | zh_TW | en_US |
| dc.title | 銅導線及其障礙層之材質研究(II) | zh_TW |
| dc.title | Microstructural Study of Copper Interconnect and Diffusion Barriers(II) | en_US |
| dc.type | Plan | en_US |